relyon plasma @ Bondexpo

The 14th Bondexpo – International Trade Fair for Bonding Technology – will open its doors in Stuttgart from 5 to 8 October 2021. We are very pleased that relyon plasma is represented at Bondexpo 2021 with its own booth. Bondexpo convinces with a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming. In addition, visitors will gain an in-depth insight into the current and future challenges in joining and bonding the broadest range of materials.

The Motek will take place in parallel at the Stuttgart Exhibition Centre. Motek is the world’s leading event in the fields of production and assembly automation, feed technology and material flow, streamlining through handling technology, and industrial handling. As such, Motek is the only trade fair to clearly focus on all aspects of mechanical engineering and automation and on the presentation of entire process chains.

Experience our innovative plasma technology up close in hall 5 at booth 5505. Two products from the piezobrush® family are unique here: the piezobrush® PZ3 handheld plasma unit and the brand-new, clever inline solution piezobrush® PZ3-i with new nozzle modules. We will also show you our plasmatool as well as our plasmacell in Stuttgart. You can try out our plasma systems directly on-site with your own materials and case studies. You are welcome to contact us in advance at info@relyon-plasma.com.

Visit us at booth 6415

Visit us at Bondexpo and get a free entrance ticket for the exhibition!